TRIDENT H625QR-G5
Immersion Server

  • 4 hot-swappable dual-socket compute nodes in a 2U chassis
  • Dual AMD EPYC™ 7003 Processors per node
  • Up to 4 TB of DDR4-3200 MHz memory per node
  • (1) M.2 SSD up to 22110 (PCIe) per node
  • Supports (2) PCIe 4.0 x16 HHHL and (1) OCP 3.0 PCIe 4.0 x16 mezzanine per node
  • (1+1) Hot-swap Redundant 3200W AC – 80 PLUS Titanium Power Supply

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AMD EPYC Processor

Tech Specs

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2U 4-Node AMD (Immersion Cooling Ready) - Chassis

Product CategoryHigh Density Compute Server
Form Factor4 hot-swappable dual-socket compute nodes in a 2U chassis
Cooling SystemSingle-Phase Immersion Cooling
Power Supply(1+1) Hot-swap redundant 3200W AC - 80 PLUS Titanium Power Supply
Dimensions
(L x W x H)
33.1” x 17.3” x 3.5”
840mm x 440mm x 86mm
Estimated Weight87 lb / 39.5 kg

Node Specifications

ProcessorDual AMD EPYC™ 7003 Processors, TDP up to 280W
Heatsink
Immersion Cooling Custom Heatsink
TIMIndium Foil
MemoryUp to 4,096 GB (16 x DIMM) DDR4-3200 MHz
8-channel memory architecture
Supports RDIMM, LRDIMM, 3DS RDIMM/LRDIMM
Network ControllerIntel® i350-AT2 Dual-Port 1GbE 1G BASE-T
Single-Port Dedicated Management 1GbE 1G BASE-T
Storage(1) M.2 SSD up to 22110 (PCIe)
Expansion Slots(2) PCIe 4.0 x16 HHHL from CPU_0
(1) OCP 3.0 PCIe 4.0 x16 mezzanine from CPU_0
GPU/FPGA CapabilitiesN/A or (1) if HH/HL
GPU/FPGA SupportUpon Request
I/O Rear(2) USB 3.0, (1) Mini DP, (1) RJ45 MLAN, (2) RJ45 Gbe Lan, (1) ID LED
ManagementAspeed® AST2500 BMC
Power SupplyN/A
OCP AvailabilityN/A
Operating Temperatures10°C~ 50°C
OS SupportWindows Server 2019, Red Hat Enterprise Linux 8.3 ( x64) or later, SUSE Linux Enterprise Server 15 SP2 ( x64) or later, Ubuntu 20.04.1 LTS (x64) or later, VMware ESXi 7.0 Update 2 or later

Single-Phase Immersion Cooling Capacity

Max Nodes Capacity per Pod
Submer MicroPod12 Nodes - 500 W Max per Node
Submer SmartPodXL84 Nodes - 600 W Max per Node
Submer SmartPod XL+84 Nodes - 1200 W Max per Node
Submer SmartPod XL+ (48U)96 Nodes - 1000 W Max per Node

Resources

Product Downloads

  •  TRIDENT H625QR-G5 Datasheet

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Trademarks: AMD, and the AMD Arrow logo, AMD EPYC, Ryzen, Threadripper and combinations thereof are trademarks of Advanced Micro Devices Inc.