TRIDENT H625QR-G5

Designed for Immersion Cooling

Experience high-density performance with the sustainable CIARA TRIDENT H625QR-G5 immersion server, powered by AMD EPYC™ 7003 Processors. Ideal for HPC, rendering, edge computing, AI, machine learning, and deep learning workloads. It is purpose-built for single-phase immersion cooling technology. It offers flexible support for up to 4 hot-swappable dualsocket compute nodes in a 2U chassis with up to 4 TB of DDR4-3200 MHz memory per node, 1 M.2 slots, 2 PCIe 4.0 x16 slots and 1 OCP 3.0 PCIe 4.0 x16 mezzanine per node.

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CIARA TRIDENT H625QR-G5 Immersion Server

TECH SPECS

Tech Specs

2U 4-Node AMD (Immersion Cooling Ready) - Chassis
Product Category	High Density Compute Server
Form Factor	4 hot-swappable dual-socket compute nodes in a 2U chassis
Cooling System	Single-Phase Immersion Cooling
Power Supply	(1+1) Hot-swap redundant 3200W AC - 80 PLUS Titanium Power Supply
Dimensions (L x W x H)	33.1” x 17.3” x 3.5” 840mm x 440mm x 86mm
Estimated Weight	87 lb / 39.5 kg
Node Specifications
Processor	Dual AMD EPYC™ 7003 Processors, TDP up to 280W
Heatsink	Immersion Cooling Custom Heatsink
TIM	Indium Foil
Memory	Up to 4,096 GB (16 x DIMM) DDR4-3200 MHz 8-channel memory architecture Supports RDIMM, LRDIMM, 3DS RDIMM/LRDIMM
Network Controller	Intel® i350-AT2 Dual-Port 1GbE 1G BASE-T Single-Port Dedicated Management 1GbE 1G BASE-T
Storage	(1) M.2 SSD up to 22110 (PCIe)
Expansion Slots	(2) PCIe 4.0 x16 HHHL from CPU_0 (1) OCP 3.0 PCIe 4.0 x16 mezzanine from CPU_0
GPU/FPGA Capabilities	N/A or (1) if HH/HL
GPU/FPGA Support	Upon Request
I/O Rear	(2) USB 3.0, (1) Mini DP, (1) RJ45 MLAN, (2) RJ45 Gbe Lan, (1) ID LED
Management	Aspeed® AST2500 BMC
Power Supply	N/A
OCP Availability	N/A
Operating Temperatures	10°C~ 50°C
OS Support	Windows Server 2019, Red Hat Enterprise Linux 8.3 ( x64) or later, SUSE Linux Enterprise Server 15 SP2 ( x64) or later, Ubuntu 20.04.1 LTS (x64) or later, VMware ESXi 7.0 Update 2 or later
Single-Phase Immersion Cooling Capacity
Max Nodes Capacity per Pod
Submer MicroPod	12 Nodes - 500 W Max per Node
Submer SmartPodXL	84 Nodes - 600 W Max per Node
Submer SmartPod XL+	84 Nodes - 1200 W Max per Node
Submer SmartPod XL+ (48U)	96 Nodes - 1000 W Max per Node

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Trademarks: AMD, and the AMD Arrow logo, AMD EPYC, Ryzen, Threadripper and combinations thereof are trademarks of Advanced Micro Devices Inc.

IMPORTANT UPDATE: Relocation of Hypertec’s Manufacturing Facility

Dear customers,

We are writing to inform you that Hypertec is in the process of relocating our manufacturing facility.

Relocation details:

We are moving our production and logistics facilities to a larger building near our headquarters.
This building is located at 5555 Cypihot, Ville Saint-Laurent, QC, H4S 1R3.
Our HQ office remains at 9300 Trans Canada. *Please note that there are no billing changes.
The relocation is scheduled to take place on December 18, 2023.

Maintaining business as usual:

This relocation gives us access to larger production and logistics facilities.
Our operations will continue without interruption during the relocation.
Orders will be processed and fulfilled with the same efficiency and commitment to quality.
New signage featuring the Hypertec logo and wayfinding signs will be displayed on the garage doors of the receiving docks in the 5555 Cypihot building.
Your Hypertec contact person at the new location will remain the same.
If you have questions, please reach out to your contact person.

Our Leadership team and employees are fully committed to ensuring seamless operations during the transition period.

Thank you,

Hypertec Team