TRIDENT HX620QR-G5
Designed for Immersion Cooling
- 4 hot-swappable dual-socket compute nodes in a 2U chassis
- Dual 3rd Gen Intel® Xeon® Scalable Processors per node
- Up to 4 TB of DDR4-3200 MHz memory per node
- (2) M.2 SSD up to 22110 (PCIe/SATA) per node
- Supports (1) PCIe 4.0 x16 HHHL and (1) OCP 3.0 PCIe 4.0 x16 mezzanine per node
- (1+1) Hot-swap Redundant 3000W AC – 80 PLUS Titanium Power Supply
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Tech Specs
2U 4-Node Intel® (Immersion Cooling Ready) - Chassis | |
| Product Category | High Density Compute Server |
| Form Factor | 4 hot-swappable dual-socket compute nodes in a 2U chassis |
| Cooling System | Single-Phase Immersion Cooling |
| Power Supply | (1+1) Hot-swap Redundant 3000W AC - 80 PLUS Titanium Power Supply |
| Dimensions (L x W x H) | 31.5” x 17.48” x 3.46” 800mm x 444mm x 88mm |
| Estimated Weight | 85 lb / 38.5 kg |
Node Specifications | |
| Processor | Dual 3rd Gen Intel® Xeon® Scalable Processors, TDP up to 270W |
| Heatsink | Immersion Cooling Custom Heatsink |
| TIM | Indium Foil |
| Memory | Up to 4,096 GB (16 x DIMM) DDR4-3200 MHz 8-channel memory architecture Supports RDIMM, LRDIMM, 3DS RDIMM/LRDIMM |
| Network Controller | Intel® I210-AT Single-Port 1GbE 1GBASE-T Single-Port Dedicated Management 1GbE 1 GBASE-T |
| Storage | (2) M.2 SSD up to 22110 (PCIe/SATA) |
| Expansion Slots | (1) PCIe 4.0 x16 HHHL (1) OCP 3.0 PCIe 4.0 x16 mezzanine |
| GPU/FPGA Capabilities | N/A or (1) if HH/HL |
| GPU/FPGA Support | Upon Request |
| I/O Rear | (2) USB 3.0, (1) VGA, (1) RJ45 MLAN, (1) RJ45 Gbe Lan, (1) Power Switch, (1) Q-code/ Port 80 LED |
| Management | Aspeed® AST2600 BMC |
| Power Supply | N/A |
| OCP Availability | N/A |
| Operating Temperatures | 10°C~ 50°C |
| OS Support | Windows Server 2019, Red Hat Enterprise Linux 8.3 ( x64) or later, SUSE Linux Enterprise Server 15 SP2 ( x64) or later, Ubuntu 20.04.1 LTS (x64) or later, VMware ESXi 7.0 Update 2 or later |
Single-Phase Immersion Cooling Capacity | |
| Max Nodes Capacity per Pod | |
| Submer MicroPod | 12 Nodes - 500 W Max per Node |
| Submer SmartPodXL | 84 Nodes - 600 W Max per Node |
| Submer SmartPod XL+ | 84 Nodes - 1200 W Max per Node |
| Submer SmartPod XL+ (48U) | 96 Nodes - 1000 W Max per Node |
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Trademarks: Intel, the Intel logo, Intel Core, Intel Inside, the Intel Inside logo, Intel vPro and Xeon are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries. Other company, product or service names may be trademarks or service marks of others.
