TRIDENT iCX610TR-G5
Designed for Immersion Cooling
- 3 hot-swappable dual-socket compute nodes in a 1U chassis
- Dual 3rd Gen Intel® Xeon® Scalable Processors per node
- Up to 4 TB of DDR4-3200 MHz memory per node
- (2) M.2 SSD up to 22110 (PCIe/SATA) and (2) Fixed 2.5” SATA HDD per node
- Supports (1) PCIe 4.0 x16 HHHL and (1) OCP 3.0 PCIe 4.0 x16 mezzanine per node
- (1) Fixed 1200W AC – 80 PLUS Platinum Power Supply per node
Powered by
Tech Specs
1U 3-Node Intel® (Custom Designed for Immersion Cooling) - Chassis | |
| Product Category | Super High Density Compute Server |
| Form Factor | 3 hot-swappable dual-socket compute nodes in a 1U chassis |
| Cooling System | Single-Phase Immersion Cooling |
| Power Supply | Included in Node |
| Dimensions (L x W x H) | 33.26” x 21.06” x 1.71” 845mm x 535mm x 43.5mm |
| Estimated Weight | 62.7 lb / 28.5 kg |
Node Specifications | |
| Processor | Dual 3rd Gen Intel® Xeon® Scalable Processors, TDP up to 270W |
| Heatsink | Immersion Cooling Custom Heatsink |
| TIM | Indium Foil |
| Memory | Up to 4,096 GB (16 x DIMM) DDR4-3200 MHz 8-channel memory architecture Supports RDIMM, LRDIMM, 3DS RDIMM/LRDIMM |
| Network Controller | Intel® I210-AT Single-Port 1GbE 1GBASE-T Single-Port Dedicated Management 1GbE 1 GBASE-T |
| Storage | (2) Fixed 2.5” SATA HDD (2) M.2 SSD up to 22110 (PCIe/SATA) |
| Expansion Slots | (1) PCIe 4.0 x16 HHHL (1) OCP 3.0 PCIe 4.0 x16 mezzanine |
| GPU/FPGA Capabilities | N/A or (1) if HH/HL |
| GPU/FPGA Support | Upon Request |
| I/O Rear | (2) USB 3.0, (1) VGA, (1) RJ45 MLAN, (1) RJ45 Gbe Lan, (1) Power Switch, (1) Q-code / Port 80 LED |
| Management | Aspeed® AST2600 BMC |
| Power Supply | (1) Fixed 1200W AC - 80 PLUS Platinum Power Supply |
| OCP Availability | Yes (Q3 2022) |
| Operating Temperatures | 10°C~ 50°C |
| OS Support | Windows Server 2019, Red Hat Enterprise Linux 8.3 ( x64) or later, SUSE Linux Enterprise Server 15 SP2 ( x64) or later, Ubuntu 20.04.1 LTS (x64) or later, VMware ESXi 7.0 Update 2 or later |
Single-Phase Immersion Cooling Capacity | |
| Max Nodes Capacity per Pod | |
| Submer MicroPod | N/A |
| Submer SmartPodXL | 120 Nodes - 600 W Max per Node |
| Submer SmartPod XL+ | 120 Nodes - 850 W Max per Node |
| Submer SmartPod XL+ (48U) | 144 Nodes - 690 W Max per Node |
Resources
Product Downloads
Get Pricing
Trademarks: Intel, the Intel logo, Intel Core, Intel Inside, the Intel Inside logo, Intel vPro and Xeon are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries. Other company, product or service names may be trademarks or service marks of others.
