ORION HF X210R-G6
High Frequency Server
- 1U rackmount form factor
- Single Intel® Core™ i9-13900KS or i9-13900KF processor
- Up to 128GB DDR5 6000MHz non-ECC, un-buffered memory
- 4 x 2.5” SATA hot-swap HDD/SSD + 4 x M.2 PCIe 4.0 x4
- Supports up to 3 x PCIe cards
- Remote server management chip (BMC), IPMI 2.0+ compliant
- 1000 W or 1500 W redundant (1+1) 80 PLUS® Platinum PSU
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Tech Specs
Form Factor | 1U |
Chipset | Intel® Z690 |
Processor | Single Intel® Core™ i9-13900KS or i9-13900KF Overclocked up to 5.7GHz* *Maximum clock speed may vary depending on applications and workloads. |
Cooling System | High Performance Closed Loop Liquid Cooled System |
Memory | Up to 128GB (4 x DIMM), DDR5 6000 MHz Non-ECC, Un-buffered Memory 2-Channel Architecture |
Network Controller | 1 x Intel® i225-V 2.5Gb Ethernet |
Storage Controller | Onboard Intel® Z690 Rapid Storage Technology supports NVMe RAID 0/1/5, SATA RAID 0/1/5/10 |
Storage | 4 x 2.5” SSD Hot-swappable HDD/SSD bays 7mm M.2_1 slot (Key M), type 2242/2260/2280/22110 (supports PCIe 4.0 x4 mode) M.2_2 slot (Key M), type 2242/2260/2280 (supports PCIe 4.0 x4 mode) M.2_3 slot (Key M), type 2242/2260/2280/22110 (supports PCIe 4.0 x4 mode) M.2_4 slot (Key M), type 2242/2260/2280 (supports PCIe 4.0 x4 & SATA modes) |
Expansion Slots | 1 x PCIe 5.0 x16 FHFLDW or 2 x PCIe 5.0 x8 FHFLSW * 1 x PCIe 3.0 x16 slot (supports x4 mode or x4/x4 mode) Low-Profile *Motherboard supports PCIe 5.0 but expansion slots will first be available with PCIe 4.0 riser |
Front I/O | 1 x Power Button/LED |
Rear I/O | 1 x VGA 2 x USB 3.0 1 x 2.5GbE RJ45 LAN 1 x 1GbE RJ45 Management LAN |
Management | AST2600 Advanced Graphics & Remote Management Processor IPMI 2.0+ Compliant Web-based user interface for remote management & iKVM Limited Remote BIOS-level access and control |
Chassis Features | Tooless Rail Kit |
Power Supply | 1+1 Redundant 1000W or 1500W 80 PLUS Platinum Power Supply |
Environment | Operating: 10ºC to 25ºC (50ºF to 77ºF) @ 8% to 90% (non-condensing) Non-operating: -20ºC to 70ºC (-4ºF to 158ºF) @ 5% to 95% (non-condensing) |
Dimensions (DxWxH) | 764mm x 436mm x 44mm 30" x 17.24" x 1.7" |
Estimated Weight | 16.5 kg / 37.4 lb |
OS Support | RHEL 8.6 and RHEL 9.0, support for other versions available upon request |
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Trademarks: Intel, the Intel logo, Intel Core, Intel Inside, the Intel Inside logo, Intel vPro and Xeon are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries. Other company, product or service names may be trademarks or service marks of others.