TRIDENT iC615DR-G6
Designed for Immersion Cooling
Discover the TRIDENT iC615DR-G6 High Density Compute Server, a 1U, 2-node AMD chassis specially designed for Immersion Cooling. This cutting-edge server houses 2 dual-socket compute nodes within a compact 1U chassis, optimized for Single Phase Immersion Cooling. With Dual AMD EPYC 9004 Processors (TDP up to 400W) and up to 6TB DDR5-4800 MHz RDIMM/3DS (24 x DIMM), experience unparalleled performance. Ideal for HPC, rendering, edge computing, AI, machine learning, and deep learning workloads. Upgrade your computing power now!
Powered by
Tech Specs
1U 2-Node AMD (Custom Designed for Immersion Cooling) - Chassis | |
Product Category | High Density Compute Server |
Form Factor | 2 dual-socket compute nodes in a 1U chassis |
Cooling System | Single-Phase Immersion Cooling |
Power Supply | Included in each Node - Single CRPSU 1600 W |
Dimensions (L x W x H) | 21” Option: 34.01” x 20.30” x 1.71” (864mm x 516mm x 43.5mm) 19” Option: 34.01” x 17.71” x 1.71” (864mm x 450mm x 43.5mm) |
Estimated Weight | 43.7 lb / 19.9 kg |
Node Specifications | |
Processor | Dual AMD EPYC™ 9004 Processors, TDP up to 400W |
Chipset | Embedded PCH |
Heatsink | Immersion Cooling Custom Heatsink |
TIM | Indium Foil |
Memory | Up to 6TB DDR5-4800 MHz RDIMM / 3DS (24 x DIMM) 12-channel memory architecture Supports RDIMM, LRDIMM, 3DS RDIMM/LRDIMM |
Network Controller | Intel® x710 Dual-Port 10GbE 10G BASE-T Single-Port Dedicated Management 1GbE 1G BASE-T |
Storage | 2 x M.2 NVMe SSD up to 22110 (PCIe) 2 x Fixed 2.5” SSD (HBA or RAID Card Required) |
Expansion Slots | 2 x PCIe 5.0 x16, LP HHHL |
GPU/FPGA Capabilities | N/A or 2 x if HH/HL |
GPU/FPGA Support | Upon Request |
I/O Top | 2 x USB 3.2 1 x Mini DP 1 x RJ45 MLAN 2 x RJ45 10GbE LAN 1 x Q-code/Port 80 LED 1 x VGA Port |
Management | Aspeed® AST2600 |
Power Supply | 1 x Fixed 1600W AC - 80 PLUS Platinum Power Supply |
OS Support | Windows Server 2019 Red Hat Enterprise Linux 8.3 (x64) or later SUSE Linux Enterprise Server 15 SP2 (x64) or later Ubuntu 20.04.1 LTS (x64) or later VMware ESXi 7.0 Update 2 or later |
Single-Phase Immersion Cooling Capacity | |
Max Nodes Capacity per Pod | |
Submer MicroPod | 21” Option: N/A 19” Option: 12 Nodes - 500 W Max per Node |
Submer SmartPodX (50kW) | 42 Nodes - 1200 W Max per Node |
Submer SmartPodXL (50kW) | 96 Nodes* - 600 W Max per Node |
Submer SmartPodXL+ (100kW) | 96 Nodes* - 1200 W Max per Node |
Resources
Get Pricing
Trademarks: AMD, and the AMD Arrow logo, AMD EPYC, Ryzen, Threadripper and combinations thereof are trademarks of Advanced Micro Devices Inc.