TRIDENT iC610DR-G6
Designed for Immersion Cooling
Introducing the new 1U 2-node Intel chassis custom-designed for Immersion Cooling. This powerful server features 2 dual-socket compute nodes in a sleek 1U chassis, natively built for Single Phase Immersion Cooling. Experience unmatched performance with Dual 4th Gen Intel® Xeon® Scalable Processors (TDP up to 350W) and a maximum of 6 TB memory per node at DDR5-4800 MHz (16 x DIMM). Perfect for AI, Machine Learning, HPC, Rendering workloads.
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Tech Specs
1U 2-Node Intel® (Custom Designed for Immersion Cooling) - Chassis | |
| Product Category | High Density Compute Server |
| Form Factor | 2 dual-socket compute nodes in a 1U chassis |
| Cooling System | Single-Phase Immersion Cooling |
| Power Supply | Included in each Node - Single CRPSU 1200 W |
| Dimensions (L x W x H) | 31.42" x 17.71” x 1.71” 800mm x 450mm x 43.5mm |
| Estimated Weight | 43.7 lb / 19.9 kg |
Node Specifications | |
| Processor | Dual 4th Gen Intel® Xeon® Scalable Processors, TDP up to 350W |
| Chipset | C741 |
| Heatsink | Immersion Cooling Custom Heatsink |
| TIM | Indium Foil |
| Memory | Maximum up to 2 + 4 TB (Per Node, DDR5 + Crow Pass) DDR5-4800 MHz (16 x DIMM) 8-channel memory architecture Supports RDIMM, LRDIMM, 3DS RDIMM/LRDIMM |
| Network Controller | Intel® X710-AT2 Dual-Port 10GbE 10GBASE-T Single-Port Dedicated Management 1GbE 1 GBASE-T |
| Storage | 2 x Fixed 2.5” SSD (HBA or RAID Card Required) 2 x M.2 (Up to 22110, SATA or Gen4 x2 link) |
| Expansion Slots | 2 x PCIe x16 slot (Gen5 x16 link, HHHL) |
| GPU/FPGA Capabilities | N/A or 2 x if HH/HL |
| GPU/FPGA Support | Upon Request |
| I/O Top | 2 x USB 3.1 1 x VGA 1 x RJ45 MLAN 2 x RJ45 10GbE LAN 1 x Power Switch 1 x Q-code / Port 80 LED |
| Management | Aspeed® AST2600 |
| Power Supply | 1 x Fixed 1200W AC - 80 PLUS Platinum Power Supply |
| OS Support | Windows Server 2019 Red Hat Enterprise Linux 8.3 ( x64) or later SUSE Linux Enterprise Server 15 SP2 ( x64) or later Ubuntu 20.04.1 LTS (x64) or later VMware ESXi 7.0 Update 2 or later |
Single-Phase Immersion Cooling Capacity | |
| Max Nodes Capacity per Pod | |
| Submer MicroPod | 12 Nodes - 500 W Max per Node |
| Submer SmartPodX (50kW) | 42 Nodes - 1200 W Max per Node |
| Submer SmartPodXL (50kW) | 96 Nodes* - 600 W Max per Node |
| Submer SmartPodXL+ (100kW) | 96 Nodes* - 1200 W Max per Node |
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Trademarks: Intel, the Intel logo, Intel Core, Intel Inside, the Intel Inside logo, Intel vPro and Xeon are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries. Other company, product or service names may be trademarks or service marks of others.
