TRIDENT iC610TR-G6
Designed for Immersion Cooling
Experience unprecedented performance with the sustainable CIARA TRIDENT iC610TR-G6 immersion server, powered by 4th Gen Intel® Xeon® Scalable. Ideal for HPC, rendering, edge computing, AI, machine learning, and deep learning workloads. Natively designed for single-phase immersion cooling technology, it supports up to 3 hot-swappable dual-socket compute nodes in a 1U chassis, boasting 60 cores/socket, 2 M.2 slots, 2 PCIe 5.0 x16 slots, and 6 TB DDR5 4800 MHz memory per node.
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Tech Specs
1U 3-Node Intel® (Custom Designed for Immersion Cooling) - Chassis | |
Product Category | High Density Compute Server |
Form Factor | 3 dual-socket compute nodes in a 1U chassis |
Cooling System | Single-Phase Immersion Cooling |
Power Supply | Included in each Node - Single CRPSU 1200 W |
Dimensions (L x W x H) | 31.42” x 20.30” x 1.71” 800mm x 516mm x 43.5mm |
Estimated Weight | 67 lb / 30.4 kg |
Node Specifications | |
Processor | Dual 4th Gen Intel® Xeon® Scalable Processors, TDP up to 350W |
Chipset | C741 |
Heatsink | Immersion Cooling Custom Heatsink |
TIM | Indium Foil |
Memory | Maximum up to 2 + 4 TB (Per Node, DDR5 + Crow Pass) DDR5-4800 MHz (16 x DIMM) 8-channel memory architecture Supports RDIMM, LRDIMM, 3DS RDIMM/LRDIMM |
Network Controller | Intel® X710-AT2 Dual-Port 10GbE 10GBASE-T Single-Port Dedicated Management 1GbE 1 GBASE-T |
Storage | 2 x Fixed 2.5” SSD (HBA or RAID Card Required) 2 x M.2 (Up to 22110, SATA or Gen4 x2 link) |
Expansion Slots | 2 x PCIe x16 slot (Gen5 x16 link, HHHL) |
GPU/FPGA Capabilities | N/A or 2 x if HH/HL |
GPU/FPGA Support | Upon Request |
I/O Top | 2 x USB 3.1 1 x VGA 1 x RJ45 MLAN 2 x RJ45 10GbE LAN 1 x Power Switch 1 x Q-code / Port 80 LED |
Management | Aspeed® AST2600 |
Power Supply | 1 x Fixed 1200W AC - 80 PLUS Platinum Power Supply |
OS Support | Windows Server 2019 Red Hat Enterprise Linux 8.3 ( x64) or later SUSE Linux Enterprise Server 15 SP2 ( x64) or later Ubuntu 20.04.1 LTS (x64) or later VMware ESXi 7.0 Update 2 or later |
Single-Phase Immersion Cooling Capacity | |
Max Nodes Capacity per Pod | |
Submer MicroPod | N/A |
Submer SmartPodX (50kW) | 63 Nodes - 800 W Max per Node |
Submer SmartPodXL (50kW) | 144 Nodes* - 400 W Max per Node |
Submer SmartPodXL+ (100kW) | 144 Nodes* - 813 W Max per Node |
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Trademarks: Intel, the Intel logo, Intel Core, Intel Inside, the Intel Inside logo, Intel vPro and Xeon are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries. Other company, product or service names may be trademarks or service marks of others.